Solidigm Unveils the Future of AI Server Cooling

At GTC 2025, Solidigm made headlines by introducing one of the world's first liquid-cooled enterprise SSDs, a technological breakthrough designed to redefine AI server infrastructure. The company, long revered for its innovative data storage solutions, has partnered with NVIDIA to overcome traditional cooling limitations and deliver a fully liquid-cooled SSD that eliminates the need for fans.

A New Era in Data Center Efficiency

AI servers, already burgeoning at a compound annual growth rate significantly outpacing general-purpose servers, are at the forefront of modern tech infrastructure. With multiple units now requiring over 30TB of storage and predictions forecasting the shipment of 2 million AI server units by the end of 2025, the introduction of this SSD is timely and transformative. Previous challenges in component-specific cooling had restricted fully liquid-cooled implementations, but Solidigm’s novel approach—with its cold-plate-cooled eSSD and proprietary E1.S design—addresses these issues head-on.

Transformative Benefits for AI Infrastructure

This breakthrough technology offers several key benefits:

• Energy Efficiency: Lowers HVAC costs by eliminating traditional air cooling.
• Enhanced Operability: Supports full eSSD serviceability and hot swapping capabilities.
• Compact Design: Allows for completely fanless, 1U server configurations, ideal for dense data centers.
• Reliable Cooling: Distributes heat evenly through its unique E1.S case design, ensuring all components remain cool even under heavy workloads.

Imagine a bustling data center where every server achieves peak performance thanks to a cooling system so efficient that bulky fans are a thing of the past. By channeling liquid cooling through its innovative cold-plate kit, Solidigm pioneers a new standard in thermal management in AI servers—ensuring reliability and performance even in the most challenging operational environments.

Advanced Packaging and Future Availability

Solidigm’s latest product builds on its legacy of design innovation, first marked by the introduction of the renowned “ruler” form factor. Now, with the D7-PS1010 E1.S available in both a 9.5mm variant (with a cold-plate kit for liquid cooling) and a 15mm option suited for air-cooled systems, the company offers versatile solutions adaptable to diverse deployment needs. This technology, initially showcased at Booth #1602 during GTC 2025, is set to revolutionize AI server setups when it becomes available later this year.

Solidigm's advancement not only underpins the rise of AI but also promises significant operational savings and performance enhancements, paving the way for the next generation of data center innovation.